tape and box type led lamps ligitek electronics co.,ltd. property of ligitek only ly2640/s76-pf/tbs-x - 2007 a doc. no : qw0905- rev. : date : 28 - dec. data sheet ly2640/s76-pf/tbs-x pb lead-free parts
w2 p2 h f p t w1 w3 l w0 d p1 h1 h2 ly2640/s76-pf + - 2.9 3.1 2.54typ 25.0min 1.0min 0.5 typ 1.5 max 3.3 4.3 ligitek electronics co.,ltd. property of ligitek only 1/6 page part no.ly2640/s76-pf/tbs-x package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice.
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 60 -40 ~ +100 -40 ~ +85 ir10 ratings y 80 20 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/6 35 585 gaasp/gap50 viewing angle 2 1/2 (deg) min. 8.0 20 min. 1.7 forward voltage @ ma(v) max. 2.6 peak wave length pnm spectral halfwidth nm typ. luminous intensity @10ma(mcd) 12 emitted part no ly2640/s76-pf/tbs-x material lens color yellow yellow diffused part no.ly2640/s76-pf/tbs-x
0.38 0.3 0.06 0.23 0.75 0.16 0.61 0.51 0.43 1.42 0.76 0.79 1.0 0.98 0.82 0.93 1.12 1.04 0.89 0.73 0.08 0.12 0.17 inch front-to-rear deflection component lead pitch tape feed hole diameter feed hole to bottom of component feed hole to overall component height lead length after component height feed hole pitch lead location center of component location overall taped package thickness feed hole location adhesive tape width adhesive tape position tape width remark:tbs=tape and box straight leads ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- tbs-3 tbs-7 tbs-9 tbs-10 tbs-8 tbs-5 tbs-6 tbs-4 tbs-1 tbs-2 ------- ------- ------- mm inch mm 17.5 w30.69 14.5 w1 w2 w0 0.57 00 8.5 0.33 19.0 15.5 4.0 9.75 ------- p2 t p1 0.2 5.1 ------- 4.40.17 12.4 ------- l p h2 w0 0.49 ------- 7.7 1.42 5.8 11.0 13.0 36 1.0 25.526.5 0.94 24.0 19.0 18.4 24.5 0.75 0.72 0.96 27.5 19.9 22.5 h1 0.89 0.78 1.08 25.0 20.0 19.4 25.5 23.5 20.9 28.5 17.5 21.5 ------- h 0.69 0.85 ------- d f 0.15 3.8 2.30.09 18.5 22.5 2.0 4.2 3.0 maximum minimum specifications symbol option code symbol items dimensions symbol information ? 3/6 page ligitek electronics co.,ltd. property of ligitek only l h dimensions symbol information ? overall thickness overall width overall length specification quantity/box 2500pcs h w 501.97 26510.4 description minimum l33013.0 mminch symbol package dimensions ? 602.4 27510.8 w maxmum 34013.4 mminch part no.ly2640/s76-pf/tbs-x
1000 ligitek electronics co.,ltd. property of ligitek only 3.0 fig.2 relative intensity vs. forward current 1000 100 10 forward current(ma) 2.5 2.0 0.5 1.0 1.5 0.0 1.0 5.0 4.0 3.0 2.0 forward voltage(v) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a y chip 1000 10 1.0 1.0 0.1 f o r w a r d c u r r e n t ( m a ) 100 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 3.0 2.0 1.0 1.5 2.5 fig.4 relative intensity vs. temperature 100 40 20 06080 0.0 100-40 020406080 ambient temperature( ) -20 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 1.2 1.1 0.9 1.0 0.8 -40-20 1.0 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) 900 800 700 wavelength (nm) 0.5 0.0 600 r e l a t i v e i n t e n s i t y @ 2 0 m a page4/6 75%50% -30 100% 25% 0 25%75% 50% 60 0 30 100% -60 fig.6 directivity radiation part no.ly2640/s76-pf/tbs-x
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 5 /sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 25 120 preheat 50 100 2 /sec max temp( c) 260 260 c3sec max time(sec) 150 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile page 5/6 ly2640/s76-pf/tbs-x part no.
6/6 page ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=85 2.rh=85% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. ly2640/s76-pf/tbs-x part no.
|
